KY8030Canadian Pacific Northwest EMS leader Dorigo Systems has installed Koh Young KY8030-3 SPI and Zenith 3D AOI systems in their newest SMT PCBA manufacturing line, adding 3D measurement and inspection capability for printed solder paste (SPI) as well as completed SMT assemblies (AOI). Both systems are intended to optimize productivity and ensure product quality through process optimization through Koh Young's patented measurement and inspection technologies.

The combination of KY8030-3 SPI and Zenith AOI inspection solutions provides comprehensive defect prevention and yield improvement tools for Dorigo Systems to ensure that optimum quality is built into their products. Koh Young is the market leader for full 3D Solder Paste Inspection (SPI) and 3D Automated Optical Inspection (AOI) of SMT PCB assemblies.

"At any given time, we typically have over 300 open production jobs at our two operating plants, utilizing a wide variety of processes and equipment, and servicing the production requirements of more than 30 active customers," says Mark Pillon, P. Eng., company President. "It's essential that our production process is optimized so that we can ship the highest quality defect-free product all the time with minimal process issues in our high-mix environment. We're confident that these new Koh Young systems will help our production maintain its competitive edge."

Koh Young's KY8030-3 true 3D SPI measurement system provides full patented 3D measurement for the complete range of solder paste measurement and inspection across a wide measurement range while ensuring accuracy without sacrificing resolution.

With its authentic 3D measurement capability, Koh Young's Zenith AOI system can detect all types of defects with real measurement values, allowing much easier defect evaluation and process control.